Automated Roll-To-Roll Fluidic Self-Assembly Of Microscopic Inorganic Semiconductor Chips For Applications Of Macroelectronics

Abstract

This paper presents the implementation of an automated roll-to-roll fluidic self-assembly system based on surface tension driven self-assembly with applications in the field of macroelectronics. The reported system incorporates automated agitation, web motion, component dispensing, and recycling. The process enables the assembly and electrical connection of semiconductor dies/chips in a continuous and parallel fashion over wide area substrates. At present the method achieves an assembly rate of 15,000 chips per hour and an assembly yield exceeding 99%. The identification and modeling of the relationship between process parameters and forces on one side and assembly rates, detachment rates, error rates, and yield on the other is discussed as it lead to the discovery of the reported design. As an application we demonstrate the realization of a solid state lighting module. This particular application requires the assembly of a conductive multilayer sandwich structure which is achieved by combining the introduced assembly process with a novel lamination step. We also have demonstrated rubber-like solid-state-lighting module using developed process.