Modeling planarization in chemical-mechanical polishing

Alagoz, Dilek
Hoogendoorn, Stephanie
Kakollu, Satyanarayana
Reznikoff, Maria
Schugart, Richard
Sostarecz, Michael
2002-07
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Modeling planarization in chemical-mechanical polishing

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2002-07

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A mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, fluid flow, and friction are considered. Fluid flow and friction effects are determined to be insignificant in the current model. Numerical results for the model including pad bending are presented and compared to experimental data.

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Institute for Mathematics and Its Applications>IMA Preprints Series

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Alagoz, Dilek; Hoogendoorn, Stephanie; Kakollu, Satyanarayana; Reznikoff, Maria; Schugart, Richard; Sostarecz, Michael. (2002). Modeling planarization in chemical-mechanical polishing. Retrieved from the University Digital Conservancy, https://hdl.handle.net/11299/3793.

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