A mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, fluid flow, and friction are considered. Fluid flow and friction effects are determined to be insignificant in the current model. Numerical results for the model including pad bending are presented and compared to experimental data.
Institute for Mathematics and Its Applications>IMA Preprints Series
Alagoz, Dilek; Hoogendoorn, Stephanie; Kakollu, Satyanarayana; Reznikoff, Maria; Schugart, Richard; Sostarecz, Michael.
Modeling planarization in chemical-mechanical polishing.
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